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High-precision die bonder Product List and Ranking from 4 Manufacturers, Suppliers and Companies

High-precision die bonder Product List

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[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly

[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly

Multiple processes with a single device! Bonding position accuracy of 0.5µm!

The package of optical components consists of the implementation of optical systems (lenses, prisms, apertures, filters, etc.) and electronic components (LD, PD, amplifiers, controllers, etc.). These are widely used in communication technologies where optical signals are converted to electrical signals, or vice versa. High-precision positioning of the optical systems and electronic components during implementation is essential for the normal operation of the package.

  • Bonding Equipment

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High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.

High-precision die bonder femto blu with a mounting accuracy of 2.0μm@3σ.

This is a high-precision die bonding machine with ultra-low load control, fully automatic operation, and compatibility with fine chips. *Technical materials are also available!

This is a die bonder device that supports various bonding processes for prototype development and high-yield manufacturing, particularly suitable for the assembly of optical components and optoelectronic components. It achieves a stable process manufacturing environment and employs a sealed enclosure that considers the safety of process gas usage and UV irradiation for operating personnel. 【Key Features】 • Mounting accuracy of 2μm@3σ • Multi-chip support • Cost-effective equipment configuration • Compatible with various assembly processes (adhesive, solder, thermal compression, ultrasonic) • Wide range of component supply methods (wafer, waffle pack, Gel-Pak) • Overlay vision alignment system (VAS) with fixed beam splitter • Fully automatic and manual operation *For more details, please download the PDF or contact us.

  • others

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Flip chip bonder, high-precision die bonder

Flip chip bonder, high-precision die bonder

Ideal for prototype development of laser diodes and fine chip implementation.

Installation of two cameras, top and bottom. Alignment based on chip alignment marks, bumps, pads, and outlines. High-precision bonding is performed. A general-purpose simple flip chip bonder that is not restricted by device types, materials, or bonding methods.

  • Steel

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12-inch high-precision die bonder for stacked packages

12-inch high-precision die bonder for stacked packages

Supports high-precision stacked packages such as NAND flash.

The needleless pickup system can pick up ultra-thin chips without damage. World-class bonding precision ~ High precision XY: ±8μm θ: ±0.05 (3σ) ~ Versatile handling ~ Compatible with sizes from 1.0 to 25.0mm and substrate sizes from 100 to 315mm ~

  • Bonding Equipment

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High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>

High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>

High-speed Die Bonder compatible with micro and thin chips!

We would like to introduce the high-precision die bonder "AB-1000" manufactured by Athlete FA, which we handle. It achieves mounting accuracy of XY: ±5[μm], θ: ±1[deg] (±3σ). It is compatible with small and thin chips. It comes with calibration, traceability, and post-mount inspection functions. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves high-precision mounting ■ Compatible with small and thin chips ■ Equipped with calibration function ■ Equipped with traceability function ■ Equipped with post-mount inspection function *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate transport device (loader/unloader)

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Fully automatic high-precision die bonder "FINEPLACER femto2"

Fully automatic high-precision die bonder "FINEPLACER femto2"

Demonstrates excellent high-precision mounting accuracy in mass production and prototype development. *Technical materials related to bonding are currently being distributed.

The "FINEPLACER femto2" is a fully automatic high-precision die bonding machine that achieves a mounting accuracy of 0.3μm @ 3 sigma. It supports various mounting methods such as thermal eutectic, ultrasonic, and more, ensuring a consistently stable assembly process even when transitioning from product development to full-scale manufacturing. 【Features】 ■ High-precision alignment with UHD vision alignment system ■ Integrated process management for quick adaptation to multiple mounting processes ■ Compatible with various mounting processes (thermal compression, soldering, adhesives, ultrasonic, etc.) ■ Modular system design allows for diverse configurations ■ Process environment managed with cleanroom quality ■ Equipped with three-color LED lighting for excellent visibility and image recognition ■ Intuitive operation via touch screen panel *You can view product materials and technical documents related to bonding by downloading the PDF. Please feel free to contact us with any inquiries.

  • Other semiconductor manufacturing equipment

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High-Precision Die Bonder AB-1000 (Manufactured by Athlete FA)

High-Precision Die Bonder AB-1000 (Manufactured by Athlete FA)

High-speed Die Bonder compatible with micro and thin chips.

The bonder "AB-1000" is complete. Achieved mounting accuracy (XY: ±5 [μm], θ: ±1 [deg] (±3σ)). Compatible with small and thin chips.

  • Bonding Equipment

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